an independent field guide to 23 million papers from arXiv & OpenAlex — not affiliated with arXiv.org
Author
37 papers · 1990–2017
showing 1–25 of 37 RSS
J. Saxena, Kenneth M. Butler, Vinay Jayaram +4 more
At-speed test has become a requirement in IC technologies below 180 nm. Unfortunately, test mode switching activity and IR-drop present special challenges to the successful application of structural atspeed tests. In this paper we characterize these problems on commercial ASICs in order to understand how to implement more effective solutions. 1
Kenneth M. Butler, J. Saxena, Ankit Jain +3 more
It is a well-known phenomenon that test power consumption may exceed that of functional operation. ICs have been observed to fail at specified minimum operating voltages during structured at-speed testing while passing all other forms of test. Methods exist to reduce power without dramatically increasing pattern volume for a given coverage. We present case study information on ATPG- and DFT-based solutions for test power reduction.
J. Saxena, Kenneth M. Butler, L. Whetsel
Power consumption during scan testing is becoming a concern. Circuit switching activity during scan shifting is high and results in high average and instantaneous power consumption. This paper presents a scheme for reducing power and provides analysis results on an industrial design.
P. Nigh, W. Needham, Kenneth M. Butler +2 more
This paper describes an experiment in which various semiconductor test methodologies (stuck-fault, functional, delay and IDDq) are applied to an ASIC device. The goal of this project is to provide the data that will enable manufacturers to optimize their application of the various tests. This project was supported through SEMATECH (Project S-121, "Semiconductor Test Method Evaluation ").
J. Saxena, Kenneth M. Butler, J. Gatt +5 more
The semiconductor industry as a whole is growing increasingly concerned about the possible presence of delay-inducing defects. There exist structured test generation and application techniques which can detect them, but there are many practical issues associated with their use. These problems are particularly acute when using low cost test equipment. In this paper, we describe an overall approach for implementing scan-based delay testing with emphasis on low-cost test.
Fei-Sheng Hsu, Kenneth M. Butler, J.H. Patel
Scan based test techniques offer a very efficient alternative to achieve high fault coverage when compared to functional pattern testing. As circuit sizes grow ever larger, test data volume and test application time grow unwieldy even in the very efficient scan based designs. The Illinois Scan Architecture is a low cost alternative to conventional scan. In this paper, we present the first ever reported case study of the effectiveness of the Illinois Scan Architecture on an industrial circuit.
Michael R. Grimaila, Sooryong Lee, Jennifer Dworak +8 more
For many years, non-target detection experiments have been simulated by using AND/OR bridges or gross delay faults as surrogates. For example, the defective part level can be estimated based upon surrogate detection when test patterns target stuck-at faults in the circuit. For the first time, test pattern generation techniques that attempt to maximize non-target defect detection have been used to test a real, 100% scanned, commercial chip consisting of 75 K logic gates. In this experiment, the defective part level for REDO-based patterns was 1,288 parts per million lower than that achieved by DC stuck-at based patterns generated using today's state of the art tools and techniques.
Mohammad Tehranipoor, Kenneth M. Butler
As technology scales to 32 nm and functional frequency and density continue to rise, PSN effects, which can reduce a circuit's noise immunity and could lead to failures, pose new challenges to chip manufacturers and foundries. This article provides an overview of low-power and delay testing, and surveys ongoing research for analyzing and dealing with PSN effects during delay test and timing analysis.
Nisar Ahmed, Mohammad Tehranipoor, C.P. Ravikumar +1 more
At-speed testing is becoming crucial for modern very-large-scale-integration systems, which operate at clock speeds of hundreds of megahertz. In a scan-based test methodology, it is common to use a transition delay fault model for at-speed testing. The launching of the transition can be done either in the last cycle of scan shift [launch-off-shift (LOS)], or in a functional launch cycle that follows the scan shift and precedes the fast capture [launch-off-capture (LOC)]. The LOS technique offers significant advantages over the LOC in terms of coverage and pattern count, but since it requires the scan enable (SEN) signal to change state in the time period of one functional clock cycle, considerable engineering resources are required to close the timing on the SEN signal. Low-cost testers will not be able to provide the at-speed SEN signal as required by the LOS technique. We propose a…
J. Saxena, Kenneth M. Butler, H. Balachandran +4 more
Automated fault diagnosis based on the stuck-at fault model is not always effective. This paper presents practical experiences in applying a bridging fault based diagnosis technique to a TI ASIC design. Results are presented for units into which known bridging defects have been introduced via a focused ion beam (FIB) machine.
Ender Yılmaz, Sule Ozev, Kenneth M. Butler
We present an adaptive test flow for mixed-signal circuits that aims at optimizing the test set on a per-device basis so that more test resources can be devoted to marginal devices while passing devices that are not marginal with less testing. Cumulative statistics of the process are monitored using a differential entropy-based approach and updated only when necessary. Thus, process shift is captured and continuously incorporated into the analysis. We also include provisions to identify potentially defective devices and test them more extensively since these devices do not conform to learned collective information. We conduct experiments on an low-noise amplifier circuit in simulations, and apply our techniques to production data of two distinct industrial circuits. Both the simulation results and the results on large-scale production data show that adaptive test provides the best…
Ender Yılmaz, Sule Ozev, Kenneth M. Butler
Despite their small size, analog/mixed-signal circuits start with an extensive set of parameters to test for. During production ramp up, most of these tests are dropped using statistical analysis techniques based on the dropout patterns. While effective in reducing the number of tests, this approach treats each device in an identical manner. As the statistical diversity of the devices increases due to increasing process variations, such homogeneous testing approaches may prove to be inefficient. After a number of initial measurements, device-specific information is available, which can provide clues as to where in the process space that device falls. Using this information, the test set for each device can be tailored with respect to its own statistical information. In this paper, we present an adaptive test flow for mixed-signal circuits that aims at optimizing the test set per-device…
The order in which the various test types are applied can have an impact on the overall efficiency of the test operation. Furthermore, the speed at which the tests can be executed and the latency of defect detection are also important factors. In this paper, we evaluate an exhaustive set of test orderings over a variety of assumed execution parameters to analyze their effects on overall tester time consumption.
Kapil Gotkhindikar, W.R. Daasch, Kenneth M. Butler +2 more
This paper introduces an adaptive test method to dynamically control test flow and test contents with continuous per die updates of test fail rates. The method employs Bayesian statistics to model a separate fail rate for each test. Test reordering and elimination is based on statistics of these predicted fail rates and is naturally monitored by a wafer based reset. Wafer sort test response data for two 65nm integrated circuit products is used to demonstrate this method. Test time reductions of about 30% are achieved with quality levels within industry expectations.
D.B. Lavo, B. Chess, T. Larrabee +3 more
Effective bridging fault diagnosis requires reducing the (/sub 2//sup n/) number of bridging faults to a handful of candidates. A preliminary step can reduce the O(n/sup 2/) candidates to a manageable O(n) candidates by using layout information to eliminate those bridging faults that are very unlikely to be shorted together. This step removes from consideration those faults that match the fault signature but are physically impossible. However, sometimes-perhaps due to issues of intellectual property or because the degree of information stored about a circuit changes over its lifecycle-the physical design of the circuit is not available, and the number of nodes is too large to explicitly consider all pairs. In this paper we present two ways to provide successful diagnoses without access to physical information. The second method produces optimal diagnoses under our ranking criteria.…
Erik Jan Marinissen, Adit D. Singh, Dan Glotter +6 more
Adaptive testing is a generic term for a number of techniques which aim at improving the test quality and/or reducing the test application costs. In adaptive tests, the test content or pass/fail limits are not fixed as in conventional tests, but dependent on other test results of the currently or previously tested chips. Part-average testing, outlier detection, and neighborhood screening are just a few examples of adaptive testing. With this Embedded Tutorial, we are offering an introduction to this topic, which is hot in the test community, to the wider DATE audience.
Kenneth M. Butler, M. Ray Mercer
A new method, Difference Propagation, is proposed to analyze fault models in combinational circuits. It propagates Boolean functional information represented by ordered binary decision diagrams. Results are presented concerning exact detectabilities and syndromes for a set of benchmark circuits. The data suggest answers to open questions in CAD and represent the first data of this type for bridging faults. The information is shown to affect testable design as well as test generation.
Kenneth M. Butler, Suresh Subramaniam, Amit Nahar +3 more
Burn-in and the concomitant post-burn-in retest are significant cost adders to the overall IC manufacturing and test process. Methods to reduce burn-in capacity are continually sought. Traditional outlier screens such as fixed-limit analyses with parametric or non-parametric statistics, when applied to the newest technologies, result in excessive Type I or II errors which cannot be tolerated. In this paper, we describe the results from applying statistical burn-in avoidance techniques using time-zero sort test responses to driver designs fabricated in 90nm and 65nm low leakage technologies and libraries
Rhonda Gaede, M.R. Mercer, Kenneth M. Butler +1 more
An improved algorithm is presented for identifying redundant faults and finding tests for hard faults in combination circuits. A concurrent approach is proposed which is based on the concepts of functional decomposition, explicit representation of fanout stems, and the Boolean difference. The data structure used is the binary decision diagram. The algorithm operates as a back end to test generators which use random patterns or heuristics or a combination of the two.< <ETX xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">></ETX>
Kenneth M. Butler, K.M. Johnson, John Platt +2 more
To meet market demands for the rapid introduction of new semiconductor products, automated means of diagnosing defective silicon are fast becoming mandatory. The authors describe the development and deployment of an automated diagnosis methodology within Texas Instruments.
Kenneth M. Butler, John M. Carulli, J. Saxena
The Williams and Brown model has long been the gold standard for estimating test escape rate as a function of yield and fault coverage. However, today's test programs have a number of differing test types, often with overlapping failing unit detections. This paper details the development of a method which permits test escape rate predictions based on product yield and multiple overlapping test coverages.
G. Hetherington, G. Sutton, Kenneth M. Butler +1 more
The TMS320C80 is a programmable, parallel processing DSP. The test approach was an engineering mix of design for testability, test view creation, and verification. This mixture facilitated timely test generation and had other important benefits. We document the overall test methodology and the benefits derived therein.
T.J. Powell, Kenneth M. Butler, M.D. Ales +2 more
The Texas Instruments TMS370 is in volume production. Sample manufacturing data has been collected to correlate stuck fault grades to the defect levels that would have been realized at those grades, at both the module and chip levels. Since the chip is composed of test isolatable modules, the data collected provide insights into the randomness of the distribution of failures among the modules. Further analysis shows good agreement between actual data and theoretical defect level model predictions. The data emphasize the need for hash fault coverages and correspondingly required DFT practices in today's era of "Six Sigma" quality targets.< <ETX xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">></ETX>
H. Balachandran, James R. Parker, Gordon Gammie +4 more
High levels of integration have complicated the entire IC manufacturing process. Crucial steps such as ramp to volume production and yield improvement techniques are being challenged. In this paper, a diagnostic system that has been developed and deployed into a production environment is presented. Experiments conducted demonstrating the value of the diagnostic tool and its limitations are presented.
Ender Yılmaz, Sule Ozev, Kenneth M. Butler
Manufactured devices have a diverse performance/quality profile due to process variations. Devices with superior performance and quality are of higher value while the rest can be sold for a lower price. Separating manufactured devices according to their performance is defined as quality/performance binning and is a very effective way of lowering average device cost. In this manner, devices that have below average quality are not wasted and therefore device cost is reduced. Quality binned devices share the same design and typically go through the same manufacturing process and even the same test process. After the testing step, they are binned according to different sets of performance criteria, typically according to the customer specifications. The bin a device falls depends on the process and typically does not match the amount requested by the customers because of uncertainty…